Carbide Nozzle Scenario Mofuta oa Kopo ea Phetoho le ho Tsebahatsa Boleng
Carbide Nozzle Scenario Mofuta oa Kopo ea Phetoho le ho Tsebahatsa Boleng

Li-nozzles tsa carbide ke likarolo tse nepahetseng tse entsoeng ka lisebelisoa tse thata tsa carbide (haholo-holo tungsten carbide, WC) ka li-binders tsa tšepe (tse kang cobalt, Co). Ka ho ithorisa ka boima ba Vickers bo fetang 1300 HV, khanyetso e ntle ea ho apara (makhetlo a 10-20 ho feta tšepe e lebelo le phahameng), le botsitso bo matla ba mocheso, li fetohile likarolo tsa mantlha tse ke keng tsa nkeloa sebaka makaleng a kang ts'ebetso ea indasteri, matla le lisebelisoa tsa elektroniki. Senotlelo sa ho holisa boleng ba ts'ebeliso ea bona ke ho ikamahanya le maemo-ho bapisa mofuta o nepahetseng oa nozzle le maemo a ikhethileng a ts'ebetso ho leka-lekanya ts'ebetso, ho tšoarella, le ho boloka litšenyehelo.
Maemong a ts'ebetso ea jete ea abrasive, ho kenyeletsoa ho phatloha ha lehlabathe bakeng sa ho tlosa mafome le ho seha lipoleiti tsa tšepe tse nang le khatello e phahameng ea metsi, lerako le ka hare la nozzle le lula le ts'oaroa le ho ts'oaroa ka lebelo le phahameng (ho fihla ho 800 m / s) likaroloana tsa abrasive (mohlala, alumina, silicon carbide). Bakeng sa sena, li-nozzles tsa carbide tse ntle (tse nang le boholo ba lijo-thollo tsa tungsten carbide ea 0.5-1μm) ke khetho e nepahetseng. Sebopeho sa bona sa microstructure se teteaneng haholo se fokotsa ho kenella ha likaroloana tse senyang, ho fokotsa sekhahla sa ho apara lebota la ka hare haholo-ho atolosa bophelo ba tšebeletso ka makhetlo a 3-5 ha ho bapisoa le li-nozzles tsa setso tsa ceramic le ho fokotsa nako ea ho phomola khafetsa.
Bakeng sa maemo a phahameng a mocheso a indasteri a joalo ka tlhoekiso ea khase ea tšepe e qhibilihisang le kalafo ea mosi oa litšila, li-nozzles li tlameha ho mamella ho pepesehela nako e telele ho 800-1000 ℃ ha li ntse li boloka botsitso ba phallo ea moea. Mona, li-nozzles tsa tungsten-cobalt carbide (tse nang le cobalt binder content ea 6% -8%) li sebetsa hantle haholo. Cobalt binder e theha maqhama a tsitsitseng le lithollo tsa tungsten carbide, ho thibela ho phatloha ha sebopeho ho bakoang ke ho tsukutloa ha mocheso le ho netefatsa hore ho na le phello e tsitsitseng ea atomization ea spray, e leng ea bohlokoa bakeng sa desulfurization ea khase ea flue le ho tlosa lerōle.
Libakeng tsa phano ea mokelikeli o nepahetseng joalo ka tlhoekiso ea semiconductor chip le ho roala liphanele tsa LCD, esita le moferefere o fokolang oa mokelikeli o ka lebisa ho bofokoli bo bonyenyane (mohlala, mengoallo ea 0.1μm) holim'a lihlahisoa. Li-nozzles tsa carbide tse betliloeng - tse nang le bokaholimo ba lebota bo ka hare ba Ra≤0.02μm (e fihletsoeng ka ho sila ka mokhoa o nepahetseng oa mehato ea 12) - tlosa li-eddies tse nang le mokelikeli, ho etsa hore ho be le tšireletso e tšoanang ea spray (ka ho kheloha ka tlase ho 5%) le ho finyella litlhoko tse nepahetseng haholo tsa indasteri ea semiconductor.
Bakeng sa tikoloho ea mosebetsi o boima oa merafo (mohlala, ho thibela lerōle la merafong ea mashala le ho tsamaisa lipeipi tsa ho lokisa liminerale), li-nozzles li tobana le liphephetso tse peli: ho thulana ha mochine ho tloha likotoana tsa mashala/majoe le ho hola ho tsoang metsing a nang le liminerale tse ngata. Li-nozzles tsa carbide tse teteaneng (tse nang le botenya ba lerako la 5-8mm, makhetlo a 2-3 ho feta a li-nozzles tse tloaelehileng) le seaparo se thibelang kutu (mohlala, chromium plating) se rarolla bothata bona. Ba fokotsa makhetlo a mangata ka ho feta 60% ha ba bapisoa le li-nozzles tse tloaelehileng tsa tšepe, ba fokotsa litšenyehelo tsa tlhokomelo bakeng sa likhoebo tsa merafo.
Ho elelloa boleng ba li-nozzles tsa carbide ho tsoa ho ts'ebelisano ena e tebileng ea mofuta ona. Ka ho hlophisa liforomo tsa thepa (mohlala, ho lokisa litaba tsa cobalt), meralo ea meralo (mohlala, marako a teteaneng), le ts'ebetso e nepahetseng (mohlala, polishing e ntle haholo) ho latela litlhoko tse ikhethang tsa indasteri, ha ba fokotse litšenyehelo tsa tlhokomelo feela ka 30% -50% le ho ntlafatsa katleho ea tlhahiso ka 20% -30% empa hape ba ts'ehetsa ts'ebetso ea theknoloji ea sebaka sa marang-rang. ho seha karolo (ho hloka li-nozzles tse nang le ho nepahala ha dimensional ± 0.005mm). Ha liindasteri tse kang matla a macha, li-semiconductors, le sefofane li hahamalla litekanyetso tse phahameng tsa ts'ebetso, mokhoa oa ho itloaetsa oa li-nozzle tsa carbide o tla tsoela pele ho bula bokhoni ba bona, ho ba mokhanni oa bohlokoa bakeng sa ntlafatso ea indasteri le nts'etsopele ea boleng bo phahameng.












